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Used EVG 520 Bonder by ClassOne Equipment, Inc.
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Product Description
Fusion compression bonder, up to 8"/200mm wafer capable, 3.5kN max bond force.
Item 2610
| DETAILS: | EVG 520 Bonder consisting of: - Model: EVG 520 - Manual wafer load substrate bonder - Configured for 8""/200mm wafers - Serial Number: S030122 - Vintage:2003 - Operations Manual for EVG 520 Bonder. | ||
| VINTAGE: | 2003 | ||
| CONDITION: | Excellent Condition Guaranteed. Fully Reconditioned to Factory Specifications by ClassOne. 3 Month Warranty and Full Specification Guarantee. 30 Day Right of Return. | ||
| DELIVERY: | 6-8 weeks | ||
| AVAILABILITY: | 1 | ||
| PRICE: | ID#: 2610 | ||
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