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Used Research Devices Model M8 Flip Chip Bonder Visible light flip by Direct Source Surplus,LLC

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Direct Source Surplus,LLC
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Used Research Devices Model M8 Flip Chip Bonder Visible light flip

Visible light flip chip bonder with better than 200 grams to 20kg, CCTV video overlay system, programmable pressure and termperature profiles to 400C. Chip size 0.3 to 25mm. Substrate size up to 100mm square. 7 degree theta range. 3 degree pitch and roll. Visible autocollimator. Motorized xy camera (75mm x 100mm range)and stage (25mm travel).


Used Research Devices Model M8 Flip Chip Bond


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