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SURFACE TECHNOLOGY SYSTEM MULTIPLEX ICP Inductively Coupled Plasma by Bid-Service, LLC
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Product Description
Inductively Coupled Plasma Etch System Configured for Bosch Process. Tool has a manual single wafer loadlock. Previously ran MEMS devices doing deep trench etch. Ideal for SOI wafer etching. Currently configured for 4 in. dia. substrates. Backside helium cooling. Clamp type ECS chuck. Three RF generators. Turbo and roughing pumps. CALL FOR PRICING.
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