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ROTH & RAU AK 800 RIE Large Area Plasma Processing Reactive Ion Etch by Bid-Service, LLC
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Product Description
Large Area Plasma Processing Reactive Ion Etch System (RIE). PC controller with automatic and manual mode operation. 13.56 MHz RF generator. Process Area: 400mm x 450mm. System has a load lock. Previously used for photovoltaics R&D etching of silicon, silicon dioxide, phosphor-silicate glass and silicon nitride. Date of Mfg.: 2006.
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